Chemshunisahani yo gusiga wafer ya alumina/turn table ikozwe mu ruhu rwo hejuru ruri hagati ya 99.7-99.9% bya alumina. Ceramic ifite uruhu rwo hejuru ifite ubukana budasanzwe kandi idapfa kwangirika mu gusiga wafer polishing kandi igumana imiterere myiza mu gihe kirekire. Ikozwe na PIBM. Ni kimwe mu bigize inganda za semiconductor kubera ubushyuhe bwayo budasanzwe n'uburyo ihagaze neza ndetse no kurwanya ibidukikije bikomeye byo gutunganya microchip.
Igenamigambi rya Chemical-Mechanical (CMP), rizwi kandi nka Chemical-Mechanical Polishing, ni ikoranabuhanga mu gukora ibikoresho bya semiconductor. Rikoresha ingese ya chemical n'imbaraga za mekanike kugira ngo rigorore silicon wafers cyangwa ibindi bikoresho bya substrate mu gihe cyo gutunganya.
Ibikoresho bya CMP bigabanyijemo ibice bibiri: igice cyo gusiga n'igice cyo gusukura. Igice cyo gusiga kigizwe n'ibice 4, ari byo 3 byo gusiga irangi n'igice cyo gupakira irangi. Igice cyo gusukura gifite inshingano zo gusukura no kumisha irangi kugira ngo irangi ryumire kandi rivemo. Mu bikoresho byose byo gusiga irangi, alumina ceramics igira uruhare runini.
Ubusanzwe alumina ceramics ikoreshwa mu gutegura disiki zo gusiga wafer polishing, zisaba ubuziranenge bwinshi, kuramba cyane kwa shimi, no kugenzura neza imiterere y'ubuso n'ubukonje.
Disiki yo gusya ya Chemshun 99.7% Al2O3 ikozwe mu bikoresho bya keramike bigezweho, ikwiriye gusya neza ibikoresho bitandukanye, cyane cyane gusya ibikoresho byoroshye nko gusya, keramike n'ibirahuri. Disiki yacu yo gusya ya keramike ishobora gukorwa mu bunini butandukanye hakurikijwe uburyo butandukanye bwo gusya no gusiga.
Igihe cyo kohereza: Gicurasi-30-2025
