Nka Alumina ceramic wafer polishing na disiki zitwa safiro zikoreshwa muri kimwe cya kabiri cyogukora, gusya diyama nibindi.
Inzira: Ubwoko bwose bwo Kuringaniza no Kuzenguruka, nka CMP ya mashini ya mashini ya mashini, Gukora imashini, Gukora neza.
Isuku ryinshi hamwe nigihe kirekire cyimiti
Imbaraga Zikomeye Zikomeye nubukomere
Kurwanya Ruswa Yinshi
Kurwanya Umuvuduko mwinshi
Ubushyuhe bwo hejuru Kurwanya 1700ºC
Gukuraho Abrasion Kurwanya Kurwanya
Imikorere ihebuje
Ubwoko bwose bwubunini 180.360, 450, 600mm nibindi
Izina RY'IGICURUZWA | 99.7 isuku ryinshi Alumina ceramic Polishing Lapping Disk |
Ibikoresho | 99.7% alumina |
Ingano isanzwe | D180, 360, 450, 600mm, ingano yihariye yemewe. |
Ibara | Ivory |
Gusaba | Wafer na safi CMP itunganyirizwa munganda zikora |
Min.Itegeko | 1Pic |
Igice | 99.7 Ububiko bwa Alumina | ||
Ibintu rusange | Ibirimo Al2O3 | wt% | 99.7-99.9 |
Ubucucike | gm / cc | 3.94-3.97 | |
Ibara | - | Ivory | |
Kwinjiza amazi | % | 0 | |
Ibikoresho bya mashini | Imbaraga zoroshye (MOR) 20 ºC | Mpa (psix10 ^ 3) | 440-550 |
Modulus ya Elastike 20ºC | GPa (psix10 ^ 6) | 375 | |
Vickers Gukomera | Gpa (kg / mm2) R45N | > = 17 | |
Imbaraga Zunamye | Gpa | 390 | |
Imbaraga zingana 25ºC | MPa (psix10 ^ 3) | 248 | |
Gukomera kuvunika (KI c) | Mpa * m ^ 1/2 | 4-5 | |
Ibyiza byubushyuhe | Amashanyarazi (20ºC) | W / mk | 30 |
Coefficient yo kwagura Ubushyuhe (25-1000ºC) | 1x 10 ^ -6 / ºC | 7.6 | |
Kurwanya Ubushyuhe | ºC | 200 | |
Gukoresha ubushyuhe ntarengwa | ºC | 1700 | |
Ibyiza by'amashanyarazi | Imbaraga za Dielectric (1MHz) | ac-kv / mm (ac v / mil) | 8.7 |
Umuyoboro wa Dielectric (1 MHz) | 25ºC | 9.7 | |
Ingano yo Kurwanya | ohm-cm (25ºC) | > 10 ^ 14 | |
ohm-cm (500ºC) | 2 × 10 ^ 12 | ||
ohm-cm (1000ºC) | 2 × 10 ^ 7 |
Twemeye gutumiza ibicuruzwa.
Niba ushaka kumenya amakuru menshi yibicuruzwa, nyamuneka twandikire kubuntu kandi tuzaguha ibicuruzwa byiza na serivisi nziza!